钨铜合金是一种假合金，钨与铜不互溶，充分结合了钨的高导热、高熔点、低热膨胀系数与铜高导热的特点。钨与铜的比例可以任意调整，WxCuy，x+y=100。
Tungsten copper alloy is a pseudo alloy, tungsten and copper are not miscible, fully combined the high thermal conductivity, high melting point, low thermal expansion coefficient of tungsten and the high thermal conductivity characteristics of copper. The ratio of tungsten to copper can be adjusted，WxCuy, x+y=100.
我们的钨铜合金可以做到几乎完全致密、无缺陷、细晶组织，氦质谱仪检漏材料气密性 < 5 x 10-9 Pa / m3.s，与国外产品相当。应用于微电子封装热沉、电阻焊电极、EDM电极、军用发汗材料、高温模具、高温导轨等场合。
Our tungsten copper alloy can achieve almost complete compactness, no defects, fine grain structure, airtightness < 5 x 10-9 Pa / m3.s (with helium leak detection mass spectrometer), comparable to any first-class products in the world.
