海特信科新材料科技有限公司坐落于著名的越国故地、西施故里——浙江省绍兴市诸暨。占地120亩，一期建设80,000平米厂房已建成投产，二期建成后将成为全球最大的微电子封装热沉材料及零部件、IGBT散热铜基板工厂之一。
海特信科是热沉材料专家，核心解决芯片散热和封装问题，是一家集材料研发、生产、电镀为一体的高新产业公司，达到国内顶尖、国际先进水平。海特信科核心团队的材料科研水平拥有30余年技术积累，在国内外市场都具有绝对的竞争力。
我们的高端微电子封装热沉产品种类齐全，为客户量身定制、精心打造，广泛应用于微波、射频、红外、激光、集成电路等领域。
我们还生产IGBT散热铜针板/平板、可阀冲压件、铜冲压件以及铝件，拥有强大的冲压、锻压、机加工能力，产品广泛应用于功率器件封装、5G基站天线、IGBT散热器等电子电力领域。
目前主要产品系列有：钨铜系列；钼铜系列；CMC(Cu-Mo-Cu)系列；CPC(Cu-MoCu-Cu)系列；硅铝、铝碳化硅；金刚石-铜/铝/银系列；超薄热管、均热板；铜/铝针式散热基板；纯钨、纯钼、铜、Invar、Kovar、Kovar-Cu- Kovar、Cu- Invar -Cu、Cu- Fe-Cu等材料冲压件、蚀刻件、机加工件；水冷管、热流道、微通道、管壳等焊接件；牌号系列齐全、机加工精度高、电镀可靠性高的激光器巴条钨铜电极；钨铜、钼铜、CPC、CMC、无氧铜、可阀等各种材质的裸片、镀镍、镀金载片和Spacer等。
同时，公司高度重视科技创新和技术研发，持续推进产品和工艺向新领域、新应用场景拓展，根据客户需求提供优质定制服务。
HEATSINK is expert in heat sinks / heat spreaders & Pin-Fin baseplates. As a widely recognized solution provider of microchips thermal dissipation and packaging, it is a high-tech company integrating R&D, manufacturing and electroplating of advanced metallic materials, and the quality of products has reached the international leading level. The top-quality high-end product portfolio covers a full range of high-performance microelectronic heat management materials, widely used in microwave, radio frequency, infrared, laser, integrated circuit, NEV indusindustry and many other fields.
We produce a wide variety of products:
At the same time, the company attaches great importance to scientific and technological innovation and technology research and development, continues to promote the expansion of products and processes to new fields and new applications, and provides high-quality customized services according to customer needs.
